|Technology||LIGA technology, High Aspect Ratio Manufacturing, metal MEMS designs|
|Applications||Micro parts, micro inductors, inertial sensors, ITAR compliance as required|
|Design & Engineering||MEMS, precision components, and connectors|
|Production Fabrication||State of the art, metals based, 150mm wafer based, production fab|
|Rapid Prototyping||100mm wafer line for rapid prototype development|
|Number of Employees||7 employees in Albuquerque, NM.|
|Years in Operation||15|
HT Micro is leading the way to replace conventionally manufactured switches, connectors, and machined parts with the smallest, most reliable metal microfabricated products in the world. The Company’s array of integrated micro-devices employ proprietary LIGA processes, metal materials, high aspect ratio manufacturing, and wafer level parallel processing to achieve rugged, high performance, miniaturized solutions for the medical, military, industrial, and consumer electronics applications.
|Spin Sensors - Test & Assembly Orientation||Application Note|
|Tape & Reel Packaging||Application Note|
PrecisionThe ability to maintain tolerances at small dimensions is at the core of HT's products and processes. HT's expertise is in developing fabrication processes for precision with critical dimensions while maintaining a low cost process. Milling, drilling, and other machining techniques are being replaced with HT's core microfabrication techniques - lithography, thick plating, batch processing, wafer level packaging and testing.
Integrated Metal FabricationOur continual focus on the aggressive expansion of the available processing materials base and integration capabilities is driving reliability, low cost manufacturing, and reduced product sizes. Our additive metals based technology and integrated packaging approach is especially suited to markets requiring rugged and resilient components.
High Aspect Ratio ManufacturingHT Micro employs high aspect ratio, metal based processes, to fabricate MEMS sensors, switches, and components that are made of metal. These processes enable production of complex three dimensional mechanisms while maintaining tolerances in the sub-millimeter range. The technology's advantage comes from the ability to perform wafer level processing within a very broad range of materials. The technology for wafer level processing is well known in the IC industry; however, precision mechanical fabrication in a wide variety of metals is not. HT Micro has advanced processes that enable miniaturization of magnetic and mechanical switch components without sacrificing performance. HARM allows for designs with an out of the plane feature height considerably greater than the width of the feature. This aspect ratio creates more area for flexures employed in mechanical designs. Reliability is the benefit of the high aspect ratio fabrication.
Wafer Level PackagingHT's processes enable product designs with the unique value-added benefit of directly packaging on the wafer. The self packaging methodology lends itself directly to hermetically sealed components which are rugged enough for many military and industrial applications. The components have the ability to withstand extreme temperature variations, vibration, and g-forces. Batch microfabrication supports wafer level packaging, avoiding expensive and time consuming back end of line assembly and testing. The costs of microfabricating a device is highly dependent on device footprint and final packaging.
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- +1 (505) 341-0466
- 4301 Masthead Street, NE
Albuquerque, NM 87109