Our Work

Company Overview

Technology LIGA technology, High Aspect Ratio Manufacturing, metal MEMS designs
Applications Micro parts, micro inductors, inertial sensors, ITAR compliance as required
Design & Engineering MEMS, precision components, and connectors
Production Fabrication State of the art, metals based, 150mm wafer based, production fab
Rapid Prototyping 100mm wafer line for rapid prototype development
Number of Employees 8 employees in Albuquerque, NM.
Years in Operation 17


HT Micro is leading the way to replace conventionally manufactured switches, connectors, and machined parts with the smallest, most reliable metal microfabricated products in the world.  The Company’s array of integrated micro-devices employ proprietary LIGA processes, metal materials, high aspect ratio manufacturing, and wafer level parallel processing to achieve rugged, high performance, miniaturized solutions for the medical, military, industrial, and consumer electronics applications.

HT's inertial sensors passively sense acceleration thresholds. The HT sensor is the smallest of its type and can withstand over 100,000 Gs of acceleration. While this extreme shock resilience is the hallmark of the devices reliability, the sensor also boasts a sensitivity range for acceleration ranges of 2 to 5,000 Gs. The primary application for the inertial sensor is in aerospace and defense applications. In particular, the sensor is a key component in the Department of Defense objective to supply a portfolio of precision munitions that are reliable and safe to the warfighter, results in less collateral damage, and eliminates unexploded ordnance (UXO). HT's inertial switch is qualified for DoD applications and, with an area of 3.4 mm2, replaces conventional products that are significantly larger.

Product Information

In Stock
DAT-2-S Datasheet
AT-15-B Datasheet
AT-25-S Datasheet
AT-27-B Datasheet
AT-50-T Datasheet
AT-65-B Datasheet
AT-300-S7 Datasheet
AT-500-B Datasheet
AT-500-O Datasheet
AT-500-SB Datasheet
AT-850-S Datasheet
AT-1300-B Datasheet
AT-1300-S Datasheet
AT-2150-B Datasheet
AT-2700-B Datasheet
AT-5000-B Datasheet
AT-5000 Datasheet
Coming Soon
LAT-1000 Datasheet
AT-1000SF Datasheet
AT-65-SH Datasheet

Application Notes

Spin Sensors - Test & Assembly Orientation Application Note
Tape & Reel Packaging Application Note



The ability to maintain tolerances at small dimensions is at the core of HT's products and processes. HT's expertise is in developing fabrication processes for precision with critical dimensions while maintaining a low cost process. Milling, drilling, and other machining techniques are being replaced with HT's core microfabrication techniques - lithography, thick plating, batch processing, wafer level packaging and testing.

Integrated Metal Fabrication

Our continual focus on the aggressive expansion of the available processing materials base and integration capabilities is driving reliability, low cost manufacturing, and reduced product sizes. Our additive metals based technology and integrated packaging approach is especially suited to markets requiring rugged and resilient components.

High Aspect Ratio Manufacturing

HT Micro employs high aspect ratio, metal based processes, to fabricate MEMS sensors, switches, and components that are made of metal. These processes enable production of complex three dimensional mechanisms while maintaining tolerances in the sub-millimeter range. The technology's advantage comes from the ability to perform wafer level processing within a very broad range of materials. The technology for wafer level processing is well known in the IC industry; however, precision mechanical fabrication in a wide variety of metals is not. HT Micro has advanced processes that enable miniaturization of magnetic and mechanical switch components without sacrificing performance. HARM allows for designs with an out of the plane feature height considerably greater than the width of the feature. This aspect ratio creates more area for flexures employed in mechanical designs. Reliability is the benefit of the high aspect ratio fabrication.

Wafer Level Packaging

HT's processes enable product designs with the unique value-added benefit of directly packaging on the wafer. The self packaging methodology lends itself directly to hermetically sealed components which are rugged enough for many military and industrial applications. The components have the ability to withstand extreme temperature variations, vibration, and g-forces. Batch microfabrication supports wafer level packaging, avoiding expensive and time consuming back end of line assembly and testing. The costs of microfabricating a device is highly dependent on device footprint and final packaging.

Contact Us

Get in touch with us

We would be glad to have feedback from you. Drop us a line, whether it is a comment, a question, a work proposition or just a hello.

  • info@htmicro.com
  • +1 (505) 341-0466
  • 4301 Masthead Street, NE
    Albuquerque, NM 87109