Precision

The ability to maintain tolerances at small dimensions is at the core of HT's products and processes. HT's expertise is in developing fabrication processes for precision with critical dimensions while maintaining a low cost process. Milling, drilling, and other machining techniques are being replaced with HT's core microfabrication techniques - lithography, thick plating, batch processing, wafer level packaging and testing.

Integrated Metal Fabrication

Our continual focus on the aggressive expansion of the available processing materials base and integration capabilities is driving reliability, low cost manufacturing, and reduced product sizes. Our additive metals based technology and integrated packaging approach is especially suited to markets requiring rugged and resilient components.

High Aspect Ratio Manufacturing

HT Micro employs high aspect ratio, metal based processes, to fabricate MEMS sensors, switches, and components that are made of metal. These processes enable production of complex three dimensional mechanisms while maintaining tolerances in the sub-millimeter range. The technology's advantage comes from the ability to perform wafer level processing within a very broad range of materials. The technology for wafer level processing is well known in the IC industry; however, precision mechanical fabrication in a wide variety of metals is not. HT Micro has advanced processes that enable miniaturization of magnetic and mechanical switch components without sacrificing performance. HARM allows for designs with an out of the plane feature height considerably greater than the width of the feature. This aspect ratio creates more area for flexures employed in mechanical designs. Reliability is the benefit of the high aspect ratio fabrication.

Wafer Level Packaging

HT's processes enable product designs with the unique value-added benefit of directly packaging on the wafer. The self packaging methodology lends itself directly to hermetically sealed components which are rugged enough for many military and industrial applications. The components have the ability to withstand extreme temperature variations, vibration, and g-forces. Batch microfabrication supports wafer level packaging, avoiding expensive and time consuming back end of line assembly and testing. The costs of microfabricating a device is highly dependent on device footprint and final packaging.