PassiveMicro® – When Power & Size Are Not An Option
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Short innovation cycles are the hallmark of the HT product development approach. Typically, customers can have parts in hand within 30 days of an approved design. HT’s expertise in process technology and metal materials offers unique value-added benefits in the form of packaging, testing, and interface electronics. Our self packaging methodology lends itself directly to hermetically sealed components which are rugged enough for military and industrial applications. These components have the unique ability to withstand extreme temperature variations, vibrations, and shock. Custom designs are also easily and rapidly accommodated. Dr. Todd Christenson, an HT Founder and the Chief Technology Officer, is the inventor of the basic fabrication technology at HT and works directly with new customer designs. He has worked in the MEMS and Microfabrication fields for over 20 years and has authored two book chapters in these fields. Prior to co-founding HT Micro, he was a principal member of the technical staff at Sandia National Laboratories in Electromechanical Engineering and Advanced Semiconductor Technology groups. He has over 100 papers published, 27 patents issued, and several patents pending.