Batch High Aspect Ratio Microfabrication
ht micro utilizes batch high aspect ratio metal based processes, to fabricate metal MEMS switches as components. These processes enable production of complex 3-D mechanisms while maintaining tolerances up to 0.1mm. Our competitive advantage comes from our ability to perform wafer level processing in a very broad range of materials. The technology for wafer level processing is well known in the IC industry; however, precision mechanical fabrication in a wide variety of metals is not. HT Micro has advanced processes that enable miniaturization of magnetic and mechanical switch components without sacrificing performance.
Wafer Level Packaging
ht micro’s highly innovative engineering staff also enables design for unique value-added benefits in the form of packaging. Our self packaging methodology lends itself directly to hermetically sealed components which are rugged enough for many military and industrial applications. The components have the ability to withstand extreme temperature variations, vibration, and g-forces.